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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

WET BENCH（BC3100 SERIES）

Process Coverage

RCA clean ,GATE clean ,Oxide etch ,PR strip

Tool type

Cassetteless type

Wafer size

300mm

Large silicon wafer applications

Alkali etching equipment,cleaning equipment after polishing,Pre-cleaning equipment,and finally cleaning equipment

Features & configurations

● Capacity (Wafer Pitch) : 50Wafers (25Wafers/FOUP*2)/5mm Half Pitch
● Supporting C.C.S.S,L.C.S.S
● Marangoni dry,LPD dry
● Auto dosing,bleed&feed
● Heating control,concentration control,flow rate control,pressure control et al.
● Bath overheating protection，leakage detection, Separate drainage
● SECS/GEM communication

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