The automatic Single cleaner (ZCWB-A3) is designed for fully automatic cleaning of large wafer sizes, with a processing capacity of 8-inch wafers with a minimum thickness of 150μm and 12-inch wafers with a minimum thickness of 200μm, with high cleaning efficiency. The company's self-developed warped wafer adsorption technology, precision positioning technology, Bernoulli contactless grasping technology, advanced technology, large production capacity, fill the gap in domestic wafer wafer 8-inch and 12-inch automatic cleaning equipment, in a leading position in China.

Recently, Zhicheng Semiconductor VMAX electroplating equipment has been successfully delivered to important domestic customers. The equipment is independently developed and manufactured by Zhicheng Semiconductor, and is the company's main model in the field of advanced packaging electroplating.