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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

METAL LIFT-OFF EQUIPMENT （CC SERIES）

Applications

Lift off process for power devices, filters, MEMS, LED and other fields

Wafer size

150~300mm

Process Specification

PR & metal residue free

Features & configurations

Standard configuration: 3 chambers (soaking, stripping, cleaning)
Support multiple process cavities
Maximum speed: 3000 RPM, speed accuracy: ±1RPM
NMP heating temperature Room temperature ～90℃±2℃
The maximum pressure of high-pressure degumming 18MPa
The process liquid can be recycled and filtered for use
Equipped with ultrasonic degumming function
Equipped with CO2 automatic fire extinguishing system

365英国上市(集团)有限公司-Official website

SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD.

Tel:0512-57762325 0512-55239392

Add:889 Zhonghua Road, Kunshan City, Jiangsu Province

Email:zse@zc-semi.com